BERGQUIST® GAP PAD® TGP 5000 - Henkel Adhesives
网页Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K. BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance.
BERGQUIST® GAP PAD® TGP 5000 - Henkel Adhesives
网页BERGQUIST® GAP PAD® TGP 5000是一款加固型玻璃纤维填充剂和聚合物，具有高导热性。 该材料具有极柔软的特性，同时保持弹力及服帖性。 加固型玻璃纤维材料易于处理和转换，增加了其电绝缘和抗撕裂特性。 其双面自然粘性有助于产品有效填补气隙，从而提高整体的热性能。 顶部有较低的粘性，易于处理。 BERGQUIST GAP PAD TGP 5000适合组装压力低的高性能应用。 选项和配置. 标准片装尺寸——8"x 16"或定制 <配置br> 标准厚度可 …
BERGQUIST® GAP PAD® TGP HC5000 - Henkel Adhesives
网页BERGQUIST ® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the ...
网页BERGQUIST GAP PAD TGP 5000 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance.
网页BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards ...
BERGQUIST® GAP PAD® TGP 2000 - Henkel Adhesives
网页The highly conformable nature of BERGQUIST ® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly.
BERGQUIST GAP PAD TGP 5000 - element14 Community
网页The GP5000S35-0.040-02-0404 is a 0.040-inch black thermally conductive un-reinforced Gap Pad which has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.
BERGQUIST GAP PAD TGP 5000 - Datasheet Directory
网页bergquist gap pad tgp 5000 -- bergquist gap pad tgp 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 w/mk.
BERGQUIST GAP PAD TGP 5000 - Newark Electronics
网页The GP5000S35-0.040-02-0404 is a 0.040-inch black thermally conductive un-reinforced Gap Pad which has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.
BERGQUIST® GAP PAD® TGP HC5000 - Henkel Adhesives
网页BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface.
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