Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron Technology 已开始在新加坡建设其价值数十亿美元的高带宽内存 封装设施。该公司将向该工厂投资 70 亿美元，因为预计在 AI 热潮中，未来几年对 HBM3E、HBM4 和 HBM4E 内存的需求将猛增。该设施将于 2026 年开始运营。 本文引用地址： 美光的高带宽内存 （HBM） 封装设施位于美光在新加坡现有的生产 3D NAND 和 DRAM 的晶圆厂旁边。新的 HBM ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron takes the top spot as high bandwidth memory (HMB) is the fastest growing component of artificial intelligence, growing ...

Since AI emerged as the world's next megatrend about two years ago, one product in particular has become the technology ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...