Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

Approximate $7 billion investment over the next several years to meet AI data center demandSINGAPORE, Jan. 08, 2025 (GLOBE ...

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.

We look at a chip maker’s latest expansion plans and see how the Straits Times Index notches up a record with last year’s ...