Usually the chip or die is a 25 mm square and comes in wafer trays. Die bonding machines have to be accurate down to the micron level. Semi-automatic die bonders are used for small scale applications.

A new die-attach process promises to cool power devices up to 15X more efficiently while reducing failure-inducing stresses ...

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This CuFirst process is expected to support higher yields, lower infrastructure costs and better cost of ownership compared to conventional die-to-wafer hybrid bonding. In addition to CuFirst ...