Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...
Extreme UV lithography (EUVL) and 193 nm immersion lithography enhanced by double-patterning techniques will be sufficient to maintain the lithography roadmap for several technology nodes.
Inspired by the idea of creating a maskless lithography system using a digital micromirror device (DMD), [Nemo Andrea] tore into an Anycubic Photon Ultra, DLP & resin-based 3D printer to take a ...
began selling lithography equipment for semiconductor production, hoping to reclaim a share in the market. The equipment is used to print fine circuit patterns on semiconductor wafers. Japanese ...
High-NA EUV lithography makes it possible to form fine patterns on silicon wafers with a higher resolution than previously possible, and is expected to lead to the realization of high-performance ...