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Semiconductor Engineering
22 小时
Wafer Bin Map Defect Classification Using Semi-Supervised Learning
Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...
Semiconductor Engineering
11 天
Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade ...
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
tom's Hardware on MSN
9 天
Rapidus is first Japanese company to install ASML's cutting-edge EUV machine — chipmaking ...
When you buy through links on our articles, Future and its syndication partners may earn a commission.
ExtremeTech on MSN
10 天
TSMC Offers a Peek at Its Cutting-Edge 2nm Process
N2 NanoFlex and GAA nanosheet transistors make TSMC’s 1.15x increase in chip density possible. The gate-all-around tech marks ...
The Business Journals
9 天
GlobalWafers secures CHIPS Act funding for Sherman silicon wafer factory
Peters. GlobalWafers makes silicon wafers used in chip manufacturing. Mark England, president of GlobalWafers Co., said in a ...
Digi Times
1 天
Tata Group to create 50,000 manufacturing jobs in EMS and semiconductor foray
In the year-end message to Tata Group employees, chairman N Chandrasekaran emphasized the transformative impact of ...
7 天
on MSN
Texas Instruments finalizes $1.6B CHIPs Act award
Texas Instruments (NASDAQ:TXN) announced on Friday that it has finalized the $1.6B award from the Biden administration's $53B ...
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