If Arm becomes a publicly traded company again, it wouldn’t' be a surprise. At its TechCon conference last year, Arm CEO Simon Segars said the company planned to go public again by 2023 — a ...

The highly anticipated Bluetooth 6.0 specification is here, and one of its most notable features is the addition of channel sounding, a two-way ranging technique between two Bluetooth Low Energy (LE) ...

As a Diamond Sponsor at TechCon 365, Cloudforce led impactful sessions on AI and Microsoft 365, and hosted a lively networking happy hour. At Microsoft's Elkridge, MD, headquarters, Cloudforce ...

Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and MEO satellites. Using the Compact Antenna Test Range (CATR) method, the ...

Two Hall-effect switch families, the unipolar AH332xQ and omnipolar AH352xQ from Diodes, offer a range of operating sensitivity options. The automotive-compliant ICs are suitable for a wide range of ...

Infineon has introduced 300-mm power GaN wafer technology within a scalable, high-volume manufacturing environment. The company notes that 300-mm wafers offer significant technological and efficiency ...

Artificial intelligence (AI) algorithms and supporting hardware will be critical in heralding the next stages of automated and ultimately autonomous driving, and a collaboration between Infineon and ...

One shared on LinkedIn said: “We are absolutely devastated to let you know that friend, colleague, former Radio TechCon presenter and committee member and general all-round top bloke, Chris Thame, has ...

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet sources. The platform offers three core services—design, packaging, ...

Thine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition in Frankfurt, Germany. By eliminating DSPs from optical communication ...