The company uses direct “gas-to-wafer” epitaxial technology to produce its solar wafers which achieved 24.4% efficiency on ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

The German wafer manufacturer said the result was achieved with an unspecified M6 HJT commercial production line, without ...

The Biden-Harris Administration has imposed export controls and technology restrictions on China's advanced chip sector from ...

The light activates a photoresist on the surface, which allows the etching of a pattern on the wafer. Through successive iterations of photolithography and the deposition of metals, devices with ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

The Recharged Czochralski (RCz) crystal growth process, which enables crucible re-use without powering down between pulls, is increasingly used to produce ingots for both n-type and p-type wafers ...

N2 NanoFlex and GAA nanosheet transistors make TSMC’s 1.15x increase in chip density possible. The gate-all-around tech marks ...

TSMC's first wafer fab in Kumamoto, Japan, operated by its subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has ...

NexWafe used EpiNex wafers to develop ultra-thin 70µm cells to address the growing demand for solar cells to power low earth orbit satellites. These cells exhibit radiation performance comparable to ...