Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Crucial to this complex manufacturing process is aligning the wafer with successive masks. This must be done in a rapid and repeatable manner, while maintaining nanometre precision throughout the ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

The company uses direct “gas-to-wafer” epitaxial technology to produce its solar wafers which achieved 24.4% efficiency on ...

The German wafer manufacturer said the result was achieved with an unspecified M6 HJT commercial production line, without ...

This is especially true for each increase in wafer size or improvement in a manufacturing process. It’s why aftermarket sensors are so important. These include sensors that measure incoming and ...

TSMC's first wafer fab in Kumamoto, Japan, operated by its subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has ...

NexWafe used EpiNex wafers to develop ultra-thin 70µm cells to address the growing demand for solar cells to power low earth orbit satellites. These cells exhibit radiation performance comparable to ...

These milestone results validate that NexWafe’s direct gas-to-wafer process as a seamless drop-in replacement for conventional CZ wafers, while offering the potential for significant cost ...