Electronics made using diamond-based chips would have many advantages, but have been hard to make – a new technique involving ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

That’s a bit of a stretch, yet the on-ground reality is the challenge of a wafer-thin resource pool. Something must be done soon, lest India becomes a dot on the global semiconductor map.

The German wafer manufacturer said the result was achieved with an unspecified M6 HJT commercial production line, without ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...