The Advanced Metallization Conference (AMC) marked its twentieth anniversary in 2003. Technical leaders from around the world gather to discuss developments in the areas of interconnect performance, ...

In this chapter, the materials, specifications, and methods used to complete the metallization segment is presented along with other uses of metals in chip manufacturing. Vacuum pumps (used in CVD, ...

Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at ...

The top layers of a chip that interconnect the transistors and resistors. There are usually two to four such layers made of aluminum that are separated by a silicon dioxide insulation layer. See ...

Also called "solid electrolyte" (SE) memory and "nano-ionic" memory, the programmable metallization cell (PMC) was invented by Dr. Michael Kozicki at Arizona State University. It is licensed to ...

Researchers at the Fraunhofer Institute for Solar Energy Systems ISE (Fraunhofer ISE) in Germany are developing copper metallization technology to avoid using silver in perovskite-silicon tandem ...

Called Jolywood Special Injected Metallization (JSIM), the new technique consists of a laser-assisted firing process that utilizes a customized silver (Ag) paste for the front contact formation on ...