This platform gives TSMC the opportunity to take the next step forward in exploring multiple e-beam technology as a lithography option at 22 nanometer and more advanced process nodes. Multiple e-beam ...

the lithography-aware steps like mask data preparation, optical proximity correction (OPC), and resolution enhancement techniques (RET) would need to be recalibrated or updated with new process ...

Artificial intelligence (AI) is a growing industry worth your investment dollars. Two such companies are Applied Materials ...