Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Rapidus has successfully begun installing ASML's Twinscan NXE:3800E EUV lithography system at its Innovative Integration for ...

Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...

In 2025, the tool will be used to make prototype chips using a 2nm process technology and then for commercial semiconductor production ... power light source, a new wafer handler, faster wafer ...

In the year-end message to Tata Group employees, chairman N Chandrasekaran emphasized the transformative impact of ...