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New Scientist on MSN
16d
Ultra-thin diamond wafers for electronics made using sticky tape
Electronics made using diamond-based chips would have many advantages, but have been hard to make – a new technique involving ...
10d
49ers minutia minute: Trent Williams is finished for 2024 as O-line grows wafer thin
Kyle Shanahan said a makeshift offensive line would not affect his decision to play Brock Purdy in the upcoming game against ...
Semiconductor Engineering
17d
Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade Dicing
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
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