Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...

Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...

Verification tools are getting faster and capacity is increasing, but they still can't keep up with the problem space.

The packaging and assembly challenges posed by increasingly complex sensors and MEMS.

An impedance analyzer is an electronic test instrument that measures the characteristic complex impedance curves of a ...

SEMI’s Maria Daniela Perez reviews the latest developments discussed at ITF Chip into the Future, hosted by imec at SEMICON ...

Workflow-driven EDA software and concurrent engineering for the next generation of dedicated AI chips, boosting AI ...

A new technical paper titled “Nonvolatile electrochemical memory at 600°C enabled by composition phase separation” was ...