At the IEEE International Electron Devices Meeting (IEDM), Imec is presenting breakthrough results in the hetero-integration of InP chiplets on a 300mm RF silicon interposer.
At this week’s IEEE International Electron Devices Meeting (IEDM), imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – presents breakthrough results in the ...
Abstract: This article examines the electrical-thermal-stress effects of a high-power handling limiter operating at DC-6 GHz, utilizing gallium arsenide positive-intrinsic-negative (PIN) technology ...