BGA-24 to DIP-24 SMT Adapter (1.0 mm pitch, 8 x 6 mm body)
BGA-24 (8 x 6 mm body width, 1.0 mm pin pitch) to DIP-24 (600 mil body width, 0.1" pin pitch) surface mount adapter. PCB dimensions: 1000 mils x 1200 mils x 62.5 mils (25.4 mm x 30.48 mm x 1.6 mm). PCB construction: FR-4 UL94V-0.
BGA Sockets - Ironwood Electronics
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc.
BGA adapter/socket systems are a reliable way to make BGAs pluggable. They may also be used as a high density board-to-board interconnect. The BGA device for a 0,8mm or 1mm grid is soldered to a 9929 adapter (or a 7929 adapter is soldered to a PCB), then either one can be plugged into a 9953 (0.8mm grid) or 9928 (1mm grid) surface mount socket.
BGA Socket IC & Component Sockets – Mouser - Mouser Electronics
Mouser offers inventory, pricing, & datasheets for BGA Socket IC & Component Sockets.
查找所有 TI 封装 - 德州仪器 TI.com.cn
BGA 封装以在微型封装中实现了高密度引脚解决方案而著称，针对 I/O 口要求较高的器件，它是一种常用的封装选项。 查找到 745 条 Ball Grid Array (BGA) 相关封装结果。 您可以通过不同参数设置来优化搜索结果。 查找到 745 条相关结果。 查找 BGA 封装结构图和说明书，如引脚数、间距和 …
sockets that feature compatible form factors and small footprint areas provide significant potential performance and time-to-market advantages as a project migrates from prototype to reality.
Why Choose HXC–BGA Socket for Test, Bring up or Validation? HXC-BGA sockets are designed to work with both Ceramic (CBGA) and Organic (OBGA) microprocessor and ASIC packages. Design should follow standard industry practices as defined by JEDEC standards, unless otherwise specified.
Advanced Interconnections | BGA Socket Adapter Systems
An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® BGA Socket Adapter System enables a BGA or LGA device to be plugged into a mating socket after soldering to a pinned adapter. See the SMT Value Added Services page for device attach information.
BGA Socket and BGA Adapter Systems - Mill-Max
2003年5月1日 · Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm , .050" and .8mm grid footprints. For socketing BGA devices, a socket is reflow soldered to the same footprint as the device using solder paste, and the balled device is soldered to a BGA adapter ...
Matrix Series Ball Grid Array BGA sockets | TTI, Inc.
TE Connectivity’ Matrix Series BGA Sockets utilizing HXC125 technology are ideal for prototyping and development. The sockets are fully arrayed matrix of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The solderless, compression mount HXC125 contact system allows you to test a BGA device without attaching it directly to the board.